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sSpec Number: SLAP9 CPU Speed: 2.10 GHz PCG: Bus Speed: 800 MHz Bus/Core Ratio: 10.5 L2 Cache Size: 3 MB L2 Cache Speed: 2.1 GHz Package Type: Micro-FCPGA Manufacturing Technology: 45 nm Core Stepping: M0 CPUID String: 10676h Thermal Design Power: 35W Thermal Specification: 105°C VID Voltage Range: 1.00V-1.250V Quelle: http://processorfinder.intel.com/details.aspx?sSpec=SLAP9 Product Documentation: http://www.intel.com/products/processor/core2duo/mobile/techdocs.htm |
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